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Hebei Chenfei Electronic Tech Co.,Ltd  

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12.Power Bank Circuit Boards 

Place of Origin: Hebei, China (Mainland) 
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12.Power Bank Circuit Boards

Layer count

1-36 layers

Min line width/space

3mil/3mil

Mim Mechanical drilling hole size

Board thickness≤1.2mm  0.15mm

Board thickness≤2.5mm  0.2mm

Board thickness>1.2mm  Aspect ratio≤15:1

Finished board thickness

Max: 10mm

Min: 2 layers-0.2mm; 4 layers-0.35mm; 6 layers-0.55mm;

8layers-0.7mm, 10layers-0.9mm  

Finished copper thiciness

Inner layer/outer layer:6oz/10oz      

Max panel size

610*1200mm

Impedeance Tolerance

±10%

Min Dielectric thickness

2mil

Type of dielectric meterial

FR4,high TG,Flex,rigid,rigid-flex, Halogen Free material,Aluminum based material,Copper based material,High frequency material,PTFE material,heavy copperfoil,paperphenolic plate,BT,PI,Composite material,PTFE+ metal based

Major Material supplier

FR4:Shengyi,ITEQ,Isola,KB,Arlon

PTFE:Rogers,Taconic,Nelco,Wangling,

Metal based meterial:Bergquist,Laird,Totking,ITEQ,Arlon,

 

Soldermask colour

green,red,blue,white,black,yellow

Surface treatment

HASL ,immsersion gold,immersion silver,OSP,gold finger

 

Special process

Multilayer PCB with blind or buried vias, impedance control

Quality control

AOI,100% electronic test

 


PCBA capacity

 

Mount range

0201,0402,0603.0805,1206,1210.chips,QFN,QFP,BGA,LGA,DSP,CSP assembly;through hole parts assembly

Mount Accuracy

±0.05MM

Max PCB size

Sample:400*800mm;Volume 350*550mm

Max components height

25.4mm

Min pitch for QPF/SOP/SOJ/IC

0.3mm

Min pitch for GSP/BGA

0.3mm

Test

AOI,eyes testing,function test,temperature cycling


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Tel: 86-311-85833960
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Company Info

Hebei Chenfei Electronic Tech Co.,Ltd [China (Mainland)]


Business Type:Manufacturer
City: Shijiazhuang
Province/State: Hebei
Country/Region: China (Mainland)

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