Material

Laminate materials

FR4,Alu,CEM3,Taconic,Rogers

Board cutting

Number of layers

1-32

Min. Thickness for inner layers 

(Cu thickness are excluded)

0.003"(0.07mm)

Board thickness

Standard

0.04-0.16"±10%(0.1-4mm±10%)

Min.  

Single/Double layer: 0.008±0.004"

4 layer: 0.01±0.008"

8 layer: 0.01±0.008"

Bow and twist

<7/1000

Copper weight

Outer Cu weight  

0.5-4 oz  

Inner Cu weight

0.5-3 oz

Drilling

Min size

0.0078" (0.2mm)

Drill deviation

±0.002" (0.05mm)

PTH hole tolerance

±0.002" (0.005mm)

NPTH hole tolerance

±0.002" (0.005mm)

Plating

Min hole size

0.0008" (0.02mm)

Aspect ratio

20 (5:1)

Solder mask

Color

Green,white,black,red,yellow,blue...

Min solder mask clearanace

0.003" (0.07mm)

Thickness

0.0005-0.0007"(0.012-0.017mm)

Silkscreen

Color

White,black,yellow,red,blue...

Min size

0.006" (0.15mm)  

E-test

Flying Probe Tester

Y

Controlled 

Impedance

Tolerance

±10%

Impedance tester

Tektronix TDS8200

Surface Finish

HASL,ENIG,immersion silver,immersion tin,OSP...

1

Type of Assembly

SMT Assembly (Surface-mounting technology)

Thru-hole Assembly (Through-hole soldering Technology)

2

Solder Type

Water soluble solder paste, lead free

3

Component

Component sourcing service

4

Min. IC Pitch

0.30mm

5

Foot Pin

SO, SOP, SOJ, TSOP, TSSOP, QFP, BGAand U-BGA

6

Min. Chip Placement

1005

7

Max. PCB Size

600mm*400mm

8

Min. PCB Thickness

0.35mm

9

Max. BGA Size

74mm*74mm

10

Max. Ball Pitch

1mm-3mm

11

Max. Ball Diameter

0.4mm-1mm

12

QFP Lead Pitch

0.38mm-2.54mm

13

Package

Inner package: anti-static bubble Bag

Outer Package: carton box

14

Certificate

PCB Assembly with UL, RoHS approval