1

Type of Assembly

SMT Assembly (Surface-mounting technology)

Thru-hole Assembly (Through-hole soldering Technology)

2

Solder Type

Water soluble solder paste, lead free

3

Component

Component sourcing service

4

Min. IC Pitch

0.30mm  

5

Foot Pin

SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA

6

Min. Chip Placement

1005    

7

Max. PCB Size

600mm*400mm

8

Min. PCB Thickness

0.35mm

9

Max. BGA Size

74mm*74mm

10

Max. Ball Pitch

1mm-3mm

11

Max. Ball Diameter

0.4mm-1mm

12

QFP Lead Pitch

0.38mm-2.54mm    

13

Package

Inner package: anti-static bubble Bag

Outer Package: carton box

14

Certificate

PCB Assembly with UL, RoHS approval